April 8th, 2008
Apple leaks iPhone 3G chipset in SDK
ZiPhone.org has uncovered code in the latest iPhone SDK beta that hints that the next generation iPhone will use Infineon’s SGOLD3 (PMB8878) “3.5G” processor. From their marketing material:
INFINEON IS one of the early platform vendors to support HSDPA category 8 (7.2 Mbit/s). The implementation of equalizer based advanced receiver technology improves the data throughput, especially at high data rates, by up to 40%. In addition, the software programmable slot processing in the HSDPA Rx path provides further flexibility for performance enhancements. The HSDPA performance of S-GOLD3H meets and exceeds all test cases as specified in the 3GPP standard.
AppleInsider notes:
Unlike the EDGE-only chipset from the current Apple handset, the new Infineon hardware not only adds 3G over HSDPA but runs up to the international standard’s newer 7.2 megabit per second spec — twice the speed of the 3.6-megabit access seen on most HSDPA networks.
From Wikipedia:
High-Speed Downlink Packet Access (HSDPA) is a 3G (third generation) mobile telephony communications protocol in the High-Speed Packet Access (HSPA) family, which allows networks based on Universal Mobile Telecommunications System (UMTS) to have higher data transfer speeds and capacity. Current HSDPA deployments support down-link speeds of 1.8, 3.6, 7.2 and 14.4 Mbit/s. Further speed increases are planned for the near future. The networks are then to be upgraded to Evolved HSPA, which provides speeds of 42 Mbit/s downlink in its first release.
Jason D. O'Grady is the editor of PowerPage.org, which has been publishing daily mobile technology news since December 1995. For disclosures on Jason's industry affiliations, click here or to view Jason's full profile click here.
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